As mobile electronic devices get smaller and smarter, manufacturers of advanced logic semiconductors must produce high-performance, sub-10nm logic chips in ever-increasing quantities. To compete effectively for lucrative advanced logic opportunities, manufacturers must overcome a number of technical challenges.
Key fab challenges:
- Reduce contact resistance
- Ensure defect-free epitaxy
- Minimize particle and metal contamination
Â鶹app solution:
We help advanced logic chip manufacturers address these challenges with the industry¡¯s most advanced ion implantation solutions. Our Purion platforms provide:
- Precise angle control with our exclusive Vector? Control System
- Unmatched particulate and metals contamination control
- Wide temperature range for both hot and cold implant
- Materials modification capabilities
- Gallium implant capabilities
Learn about our Purion solutions for?High Current,?High Energy?or?Medium Current, or Medium Energy.